Sputter System

▪ Deposition thickness : up to several thousands Å
▪ Film thickness uniformity : ≤ ± 5 % on OD 100x100mm substrate
▪ Substrate : 100mm X 100mm
▪ Deposition : Substrate pre cleaning by plasma before deposition and thin film deposition by magnetron co-sputtering method
▪ Throughput : 100mm x 100mm x 1 sheet
▪ Vacuum : Ultimate pressure 5 x 10 -7 Torr
▪ Vacuum chamber : process chamber
▪ Control system : Manual operation , PLC Based interlock ,Sample loading/Un loading / Automatic
▪ Purpose : Research and development