Rapid Thermal process System

▪ Manual Desktop Design
▪ 2” to 6” Wafer Size
▪ Room Temp’ up to 800℃
▪ Max Temp’ 1000℃
▪ Ramping Time : 10 ~100℃ / S up Rate
▪ Cool down rate : 1000~600℃ (20sec) , 600~400℃(80sec)
▪ Vacuum : PLC Base semi auto control
▪ Operation : 760 Torr ~ 1 x 10-2 Torr (150sec)
▪ System Size : 640 X 720 X 650 mm